Title :
Effective defect management strategies for emerging fab needs
Author :
Nurani, Raman K.
Author_Institution :
KLA-Tencor Inc., San Jose, CA, USA
Abstract :
The evolution of wafer fabrication technology and processes has seen different characteristics and varying nature of yield-limiting killer defects on the wafers. This has forced the innovation of a more sensitive and broader range of defect inspection technologies in the marketplace. Given the changing nature of defect characteristics, the multiple choices of inspection technologies, and the increasing magnitudes of fab investment costs, the problem of determining an effective defect inspection strategy for a fab has become increasingly complex. In this paper, we present the essential steps required to design and implement a cost optimal defect management strategy
Keywords :
inspection; integrated circuit economics; integrated circuit yield; strategic planning; cost optimal defect management; defect management strategies; fab investment costs; inspection technologies; wafer fabrication technology; yield-limiting killer defects; Chemical processes; Chemical technology; Copper; Cost function; Fabrication; Frequency; Inspection; Investments; Sampling methods; Technological innovation;
Conference_Titel :
Statistical Methodology, IEEE International Workshop on, 2001 6yh.
Conference_Location :
Kyoto
Print_ISBN :
0-7803-6688-3
DOI :
10.1109/IWSTM.2001.933821