DocumentCode :
3242060
Title :
Ultra high-power 2.5 kV-1800 A power pack IGBT
Author :
Takahashi, Yoshikazu ; Yoshikawa, Koh ; Koga, Takeharu ; Soutome, Masayuki ; Takano, Tetsumi ; Kirihata, Humiaki ; Seki, Yasukazu
Author_Institution :
Fuji Electr. Corp. Res. & Dev. Ltd., Matsumoto, Japan
fYear :
1997
fDate :
26-29 May 1997
Firstpage :
233
Lastpage :
236
Abstract :
The Power Pack IGBT has been tested in detail under several practical inverter systems and has obtained much useful data. Using this data and advanced technology, we have improved some items and finally developed an ultra high-power 2.5 kV-1800 A Power Pack IGBT (flat-packaged Reverse Conducting IGBT). One of the important improvements is the contact technology for the IGBT chip, and another is the electric discharge capability of the IGBT and diode chips. In addition to these important improvements, using our original 27.5×27.5mm2 large IGBT and diode chips, and square flat package structure, we have achieved a compact and powerful device. The saturation voltage is 4.5 V at the collector current of 1800A and Tj=125°C. The on-state voltage of the diode part is 3.5 V at the anode current of 1800 A and Tj=125°C. The turn-off capability is over 4000A at the peak collector voltage of 2400 V. In this paper, the device structure, the chip technology, the parallel connection technology inside the package, the high blocking voltage capability, and other important experimental results are described
Keywords :
insulated gate bipolar transistors; invertors; power transistors; semiconductor device packaging; 125 degC; 1800 A; 2.5 kV; 3.5 V; 4.5 V; blocking voltage capability; collector current; contact technology; electric discharge capability; flat-packaged reverse conducting device; inverter systems; on-state voltage; parallel connection technology; peak collector voltage; power pack IGBT; saturation voltage; square flat package structure; turn-off capability; Ceramics; Diodes; Electrodes; Insulated gate bipolar transistors; Inverters; Packaging; Pressure control; Production facilities; Research and development; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location :
Weimar
ISSN :
1063-6854
Print_ISBN :
0-7803-3993-2
Type :
conf
DOI :
10.1109/ISPSD.1997.601480
Filename :
601480
Link To Document :
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