Title :
How is high heat flux cooling technology being driven by supercomputers
Author_Institution :
Cray Inc., Chippewa Falls, WI, USA
Abstract :
To develop new technologies or new techniques to solve thermal and system packaging problems. The solution to these system packaging problems is being complicated with the introduction of new component technologies that have unique thermal and packaging requirements that also now need to be integrated into supercomputers. The cooling of high heat fluxes on components, but also with the integration of new technology with unique thermal design requirements and the integration of their thermal solution into the system design. This paper describes a new system technologies and their thermal and packaging requirements that demand new and unique high heat flux cooling solutions.
Keywords :
cooling; integrated circuit packaging; mainframes; systems analysis; thermal management (packaging); heat flux cooling solutions; heat flux cooling technology; supercomputers; system design; system packaging; thermal packaging; thermal solutions; Cooling; Electronic packaging thermal management; Engineering management; Reliability engineering; Supercomputers; Systems engineering and theory; Temperature dependence; Thermal engineering; Thermal management; Thermal management of electronics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1318359
