MEMS-based thermal management of high heat flux devices for integrated cooling of electronics

Author

Amon, Cristina H.

Author_Institution

Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Abstract

This paper describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm², employing latent heat of vaporization of dielectric fluids. Micro-spray nozzles are fabricated to produce 50-100 micron droplets coupled with surface texturing on the backside of the chip to promote spreading and boiling. A novel features to enable adaptive on-demand cooling is MEMS sensing and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micromanfacturing technologies.

Keywords

boiling; cooling; dielectric liquids; drops; heat of vaporisation; integrated circuit packaging; microactuators; microsensors; nozzles; sprays; surface texture; thermal management (packaging); wetting; 50 to 100 micron; MEMS actuation; MEMS sensing; advanced micromanfacturing technologies; boiling; chip heat fluxes; dielectric fluids; electronics package; embedded droplet impingement-integrated cooling-electronics; heat flux devices; integrated cooling; integrated droplet impingement cooling device; latent heat vaporization; microspray nozzle; spreading; surface texture; thermal management; Electronics cooling; Micromechanical devices; Power engineering and energy; Power system management; Spraying; Surface texture; Systems engineering and theory; Temperature sensors; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1318360

Filename

1318360