• DocumentCode
    3245643
  • Title

    Micromechanical sensors

  • Author

    Benecke, W.

  • Author_Institution
    Fraunhofer Inst. fuer Mikrostrukturtechnik, Berlin, West Germany
  • fYear
    1989
  • fDate
    8-12 May 1989
  • Firstpage
    14305
  • Lastpage
    17227
  • Abstract
    System integration is often limited by the incompatibility of the technologies used for the fabrication of sensors and actuators. Most of the problems related to conventional transducers, such as miniaturization, performance, and price, can be overcome by the use of silicon as a mechanical material. Therefore, there is a rapidly increasing demand for micromachined silicon transducers. The author reviews the advantages of silicon for sensor applications and the relevant characteristics of silicon. He outlines the fabrication processes used for silicon micromachining. The potential of this technology is illustrated by various examples of micromechanical sensors. The multidisciplinary use of silicon for mechanical and electronic functions on the same chip leads to completely new sensor and system concepts. Included are piezoelectric and piezoresistive devices, piezojunction transistors, accelerometers, and pressure, tactile, flow, radiation and chemical sensors. Diagrams, graphs, and photographs are provided
  • Keywords
    electric sensing devices; piezoelectric transducers; piezoresistance; accelerometers; actuators; chemical sensors; fabrication processes; flow; micromechanical sensors; piezoelectric; piezojunction; piezoresistive; pressure; radiation; sensor applications; sensors; silicon micromachining; silicon transducers; tactile; Actuators; Chemical sensors; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Sensor phenomena and characterization; Sensor systems; Silicon; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
  • Conference_Location
    Hamburg
  • Print_ISBN
    0-8186-1940-6
  • Type

    conf

  • DOI
    10.1109/CMPEUR.1989.93403
  • Filename
    93403