Title :
Critical Temperature to Dielectric Degradation of Printed Circuit Board
Author :
Liu, Yong ; Du, B. ; Zhang, Xiangjin ; Xin Jiang
Author_Institution :
Sch. of Electr. Eng. & Autom., Tianjin Univ.
Abstract :
Dielectric degradation of printed circuit board based on the thermal properties in an open-air environment was investigated. With increase of the temperature, the copper electrodes were oxidized from Cu 2O to CuO; the base material of epoxy laminate was thermally affected to the change of molecular structure and degradation of dielectric properties. With increase of the temperature, the capacitance and surface resistance decreased, the thermal stimulated current increased and showed a valley value near 450 K and a peak value near 490 K
Keywords :
copper compounds; epoxy insulation; insulation testing; permittivity; printed circuit testing; thermoelectricity; Cu2O; CuO; capacitance; copper electrodes; critical temperature; dielectric constant; dielectric degradation; epoxy laminate; molecular structure; open-air environment; printed circuit board; surface resistance; thermal properties; thermal stimulated current; Capacitance; Copper; Dielectric materials; Electrodes; Laminates; Printed circuits; Surface resistance; Temperature; Thermal degradation; Thermal resistance;
Conference_Titel :
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
Conference_Location :
Bali
Print_ISBN :
1-4244-0189-5
Electronic_ISBN :
1-4244-0190-9
DOI :
10.1109/ICPADM.2006.284125
