DocumentCode :
324965
Title :
Microelectromechanical systems (MEMS): an overview of current state-of-the-art
Author :
Madni, Asad M. ; Wan, Lawrence A.
Author_Institution :
BEI Sensors & Syst. Co. Inc., Sylmar, CA, USA
Volume :
1
fYear :
1998
fDate :
21-28 Mar 1998
Firstpage :
421
Abstract :
The applications and basics of microelectromechanical systems (MEMS) are discussed. The four main silicon micromachining techniques, i.e., bulk micromachining, surface micromachining, wafer-to-wafer bonding, and high aspect ratio micromachining are presented in detail. A microelectromechanical quartz rate sensor is also discussed. These techniques have been adapted to applications in the aerospace, military, industrial, medical, telecommunications and automotive industries to realize miniaturized highly integrated MEMS in a cost effective manner
Keywords :
micromachining; micromechanical devices; wafer bonding; MEMS; Si; aspect ratio; highly integrated MEMS; microelectromechanical systems; micromachining techniques; rate sensor; wafer-to-wafer bonding; Aerospace industry; Automotive engineering; Communication industry; Defense industry; Microelectromechanical systems; Micromachining; Micromechanical devices; Military communication; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 1998 IEEE
Conference_Location :
Snowmass at Aspen, CO
ISSN :
1095-323X
Print_ISBN :
0-7803-4311-5
Type :
conf
DOI :
10.1109/AERO.1998.686939
Filename :
686939
Link To Document :
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