DocumentCode
3250463
Title
Circuit-level electrothermal simulation of electrostatic discharge in integrated circuits
Author
Sonoda, Ken-ichiro ; Tanizawa, Motoaki ; Ishikawa, Kiyoshi ; Nishimura, Tadashi
Author_Institution
Adv. Device Dept., Mitsubishi Electr. Corp., Hyogo, Japan
fYear
1999
fDate
1999
Firstpage
215
Lastpage
218
Abstract
A circuit-level electrothermal simulator, MICS (Mitsubishi Circuit Simulator), is presented with parasitic bipolar transistor action and lattice heating taken into account. Diffusion capacitance in parasitic bipolar transistors is introduced to cover turn-on behavior under short rise-time current. Device temperatures are simulated from calculated electrical characteristics and the closed-form solution of the heat transfer equation. Simulation results show that this tool is valuable in evaluating electrostatic discharge (ESD) robustness in integrated circuits
Keywords
MOSFET; circuit simulation; electrostatic discharge; integrated circuit modelling; semiconductor device breakdown; semiconductor device models; temperature distribution; ESD robustness; MICS; MOSFET model; Mitsubishi Circuit Simulator; circuit-level electrothermal simulation; closed-form solution; device temperature simulation; diffusion capacitance; electrical characteristics; electrostatic discharge; heat transfer equation; human body model; integrated circuits; lattice heating; parasitic bipolar transistor action; short rise-time current; turn-on behavior; Bipolar transistors; Circuit simulation; Electric variables; Electrostatic discharge; Electrothermal effects; Heating; Lattices; Microwave integrated circuits; Parasitic capacitance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location
Kyoto
Print_ISBN
4-930813-98-0
Type
conf
DOI
10.1109/SISPAD.1999.799299
Filename
799299
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