Title :
A novel clustered hard mask technology for dual damascene multilevel interconnects with self-aligned via formation using an organic low k dielectric
Author :
Aoi, N. ; Tamaoka, E. ; Yamanaka, M. ; Hirao, S. ; Ueda, T. ; Kubota, M.
Author_Institution :
Semicond. Group, Matsushita Electron. Corp., Japan
Abstract :
A novel clustered hard mask technology with self-aligned via formation is developed. This technology provides dual damascene multilevel interconnects using an organic low k dielectric without via misalignment problems or degradation of low k film properties.
Keywords :
cluster tools; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; masks; organic insulating materials; permittivity; clustered hard mask technology; dual damascene multilevel interconnects; low k film properties; organic low k dielectric; self-aligned via formation; via misalignment; Copper; Dielectrics; Etching; Organic materials; Resists; Space technology; Thermal degradation; Tin; Ultra large scale integration; Wiring;
Conference_Titel :
VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
4-930813-93-X
DOI :
10.1109/VLSIT.1999.799330
