Flip-chip flex-circuit packaging for power electronics

Author

Xiao, Yue ; Jain, N.P. ; Barrett, John ; Gutmann, R.J. ; Chow, T.P.

Author_Institution

Center for Power Electron. Syst., Rensselaer Polytech. Inst., Troy, NY

fYear

2001

fDate

2001

Firstpage

55

Lastpage

58

Abstract

The development of high-density packaging for power electronics applications has been driven by the requirement for system functionality enhancement and cost reduction. In this paper we explore a novel power packaging concept, the flip-chip flex-circuit package, that eliminates bond wires and exhibits potential for high-level component integration with an established flex-circuit technology. A baseline power electronic module involving a half-bridge circuit has been fabricated and evaluated electrically

Keywords

bridge circuits; flip-chip devices; packaging; power electronics; flip-chip flex-circuit packaging; half-bridge circuit; integrated power electronic module; Bonding; Cost function; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Power electronics; Semiconductor device packaging; Soldering; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on

Conference_Location

Osaka

ISSN

1063-6854

Print_ISBN

4-88686-056-7

Type

conf

DOI

10.1109/ISPSD.2001.934558

Filename

934558