• DocumentCode
    3255486
  • Title

    The effects of void presence on the tree growth phenomena

  • Author

    Coletti, G. ; Gemme, C. ; Curinga, L. ; Verganelli, G.

  • Author_Institution
    Dept. of Electr. Eng., Genoa Univ., Italy
  • fYear
    1995
  • fDate
    10-13 Jul 1995
  • Firstpage
    487
  • Lastpage
    492
  • Abstract
    The ethylene vinyl acetate (EVA) compound has been chosen for this study because of its transparency and because it allows on to obtain a low percentage of rejects during the moulding procedure. Therefore this work was focused on the influence of artificial voids at the tip of needle electrodes on the parameters characterizing treeing inception and growth, usually considered when comparing different materials. It is worth noting here that in real insulation, dielectric strength and ageing endurance are features which generally do not directly and always depend on the presence of voids, as the latter generally are dispersed in an unknown way into the bulk or at the interfaces of the insulation. Therefore the presented findings, although interesting for material characterization, cannot be directly used for actual insulation evaluation
  • Keywords
    ageing; electric strength; insulation testing; polyethylene insulation; polymer structure; trees (electrical); voids (solid); EVA; ageing endurance; artificial voids; dielectric strength; ethylene vinyl acetate; moulding procedure; needle electrodes; polymer tips; real insulation; rejects; transparency; tree growth phenomena; treeing inception; void; Breakdown voltage; Conducting materials; Dielectrics and electrical insulation; Electrodes; Materials testing; Needles; Nonuniform electric fields; Performance evaluation; Semiconductor materials; Trees - insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1995. ICSD'95., Proceedings of the 1995 IEEE 5th International Conference on
  • Conference_Location
    Leicester
  • Print_ISBN
    0-7803-2040-9
  • Type

    conf

  • DOI
    10.1109/ICSD.1995.523034
  • Filename
    523034