Title :
Performance of poly(3-hexylthiophene) field effect transistor with high dielectric constant gate insulator
Author :
Ramajothi, J. ; Ochiai, S. ; Kojima, K. ; Mizutani, T.
Author_Institution :
Dept. of Electr. Eng., Aichi Inst. of Technol., Toyota
Abstract :
Organic field effect transistors (OFETs) were fabricated with high-kappa titanium dioxide (TiO2) as gate insulator and regioregular poly(3-hexylthiophene-2,5-diyl) (RR-P3HT) as electronically active semiconductor. The dielectric material was prepared by sol-gel method and the gate insulator layer was fabricated by spin-coating method. The thickness of the thin films was measured using surface profile measuring system. The fabricated thin films structure was analyzed by atomic force microscopy (AFM), X-ray diffraction (XRD) and UV-visible absorption spectra. The X-ray result shows that the drop-cast RR-P3HT thin film has high crystallinity on the TiO2 surface and leads to high field effect mobility of the OFET. Good characteristics performances were obtained with low threshold voltage (+3 V) and the field effect mobility is 3.73 times 10-3 cm2/Vs.
Keywords :
X-ray diffraction; atomic force microscopy; conducting polymers; crystal structure; dielectric materials; field effect transistors; high-k dielectric thin films; organic semiconductors; permittivity; sol-gel processing; spin coating; ultraviolet spectra; visible spectra; TiO2; UV-visible absorption spectra; X-ray diffraction; atomic force microscopy; dielectric constant gate insulator; dielectric material; field effect mobility; film crystallinity; high-K titanium dioxide gate insulator; organic field effect transistors; poly(3-hexylthiophene) field effect transistor; sol-gel method; spin-coating method; surface profile measuring system; thin film thickness; voltage 3 V; Atomic force microscopy; Dielectric measurements; Dielectric thin films; Dielectrics and electrical insulation; FETs; High-K gate dielectrics; OFETs; Semiconductor thin films; Thickness measurement; Titanium;
Conference_Titel :
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location :
Mie
Print_ISBN :
978-4-88686-005-7
Electronic_ISBN :
978-4-88686-006-4
DOI :
10.1109/ISEIM.2008.4664450