DocumentCode
3258690
Title
Copper Interconnect: Fabrication And Reliability
Author
Hu, C.-K. ; Harper, J.M.E.
fYear
1997
fDate
3-5 June 1997
Firstpage
18
Lastpage
22
Keywords
Conductivity; Copper; Electromigration; Fabrication; Impurities; Integrated circuit interconnections; Particle scattering; Surface resistance; Temperature; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1997. Proceedings of Technical Papers. 1997 International Symposium on
Conference_Location
Taipei, Taiwan
ISSN
1524-766X
Print_ISBN
0-7803-4131-7
Type
conf
DOI
10.1109/VTSA.1997.614718
Filename
614718
Link To Document