Performance of Cu-Plating Vertical LEDs in Heat Dissipation Using Diamond-Like Carbon

Author

Ray-Hua Horng ; Kun-Ching Shen ; Ching-Ho Tien ; Sin-Cyuan Lin ; Dong-Sing Wuu

Author_Institution

Grad. Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan

Volume

35

Issue

2

fYear

2014

fDate

Feb. 2014

Firstpage

169

Lastpage

171

Abstract

Performance in heat dissipation of Cu-plating type vertical GaN light-emitting diodes (CVLEDs) with a diamond like carbon (DLC) layer was investigated at various injection current levels. Through the incorporation of DLC, the CVLED with DLC exhibits a high heat dissipating ability, where the DLC-CVLEDs can be handled at an ultrahigh injection current of 2000 mA and reach an output power of 620 mW. In addition, the thermal resistance of the CVLED with DLC calculated by surface temperature data at 1400 mA injection current was 34% lower than that of CVLED without DLC, which clearly indicated that the benefit of using DLC layer on improvement of heat dissipation will be more significant as a higher current is injected.

Keywords

cooling; copper; diamond-like carbon; electroplating; light emitting diodes; thermal resistance; CVLED; GaN; current 1400 mA; current 2000 mA; diamond like carbon layer; heat dissipation; injection current levels; light emitting diodes; power 620 mW; surface temperature data; thermal resistance; vertical LED; Diamond-like carbon; Heating; Light emitting diodes; Power generation; Silicon; Substrates; Temperature distribution; CVLED; GaN; diamond-like carbon;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2013.2294869

Filename

6689309