DocumentCode
3259193
Title
Challenges for IC failure analysis-present and future
Author
Anderson, Richard E. ; Soden, Jerry M. ; Henderson, Christopher L. ; Cole, Edward I., Jr.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
1995
fDate
27 Nov-1 Dec 1995
Firstpage
1
Lastpage
8
Abstract
Failure analysis is a critical element in integrated circuit manufacturing. This paper explores the challenges for IC failure analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New approaches shall be required for failure analysis to keep pace with future advancements in IC technology
Keywords
failure analysis; integrated circuit testing; technological forecasting; IC failure analysis; NTRS; Si; integrated circuit manufacturing; silicon IC technology; Circuit testing; Failure analysis; Flip chip; Integrated circuit packaging; Integrated circuit technology; Integrated circuit testing; Optical microscopy; Power distribution; Voltage; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 1995., Proceedings of the 1995 5th International Symposium on the
Print_ISBN
0-7803-2797-7
Type
conf
DOI
10.1109/IPFA.1995.487587
Filename
487587
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