Fault isolation on mixed signal device

Author

Tan, Kt ; Ong, Sh ; Yong, Ct

Author_Institution

Nat. Semicond. Singapore Pte Ltd., Singapore

fYear

1995

fDate

27 Nov-1 Dec 1995

Firstpage

69

Lastpage

74

Abstract

This paper determines the failure mechanism of the mixed signal device by using the fault isolation technique. Fault isolation techniques like micro-probing liquid crystal, EMMI and OBIC allow us to pinpoint the defective location. The mixed signal device analysis in this paper is the COMBO I, TP3054N, consisting of a μ-law monolithic PCM CODEC/filters utilizing the A/D and D/A conversion architecture and a serial PCM interface. Various failure mechanisms have been analyzed using the fault isolation technique. Poly-fuse defects as well as FAB related defects were determined during the course of analysis. Successfully finding the failure mechanism allows short term corrective action to be taken as well as long term redesigns to be implemented. This in turn improves product performance and assures a more reliable design for the COMBO I device as well as the other devices in this area

Keywords

OBIC; active filters; codecs; failure analysis; fault diagnosis; integrated circuit testing; mixed analogue-digital integrated circuits; A/D conversion architecture; COMBO I; D/A conversion architecture; EMMI; FAB related defects; OBIC; PCM CODEC/filters; defective location; failure mechanism; fault isolation; micro-probing liquid crystal; mixed signal device; poly-fuse defects; Active filters; Clocks; Decoding; Failure analysis; Functional analysis; Liquid crystals; Monitoring; Phase change materials; Pulse amplifiers; Signal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 1995., Proceedings of the 1995 5th International Symposium on the

Print_ISBN

0-7803-2797-7

Type

conf

DOI

10.1109/IPFA.1995.487598

Filename

487598