Title :
Silicate contamination on ceramic IC packages and its effect on lid adhesion properties
Author :
Chin, B. ; Lim, K. ; Chong, Y.C.
Author_Institution :
Integrated Circuits Bus. Div., Hewlett-Packard, Singapore
fDate :
27 Nov-1 Dec 1995
Abstract :
This paper presents a case history of a packaging failure that was caused by contamination introduced in one of the processes on the assembly line. Results of the failure analysis via the use of the X-Ray Photoelectron Spectroscopy (XPS) for contamination at various stages of the Ceramic Pin Grid Array (CPGA) packaging assembly process, and an analysis of the contact angles obtained from the ceramic substrate surface to indicate wettability are presented
Keywords :
X-ray photoelectron spectra; adhesion; ceramics; contact angle; failure analysis; hybrid integrated circuits; impurities; integrated circuit packaging; integrated circuit reliability; wetting; XPS; ceramic IC packages; ceramic pin grid array packaging assembly process; ceramic substrate surface; contact angles; lid adhesion properties; packaging failure; silicate contamination; wettability; Adhesives; Assembly; Ceramics; Contamination; Grain size; History; Integrated circuit packaging; Rough surfaces; Surface roughness; Temperature;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1995., Proceedings of the 1995 5th International Symposium on the
Print_ISBN :
0-7803-2797-7
DOI :
10.1109/IPFA.1995.487627
