DocumentCode :
3260176
Title :
Modelling of complex interconnect structures
Author :
Rustagi, Aayush ; Jain, Kanika
Author_Institution :
ECE, JIITU, Noida, India
fYear :
2009
fDate :
23-26 Jan. 2009
Firstpage :
1
Lastpage :
6
Abstract :
Analytical model has been proposed of complex interconnect structure with ten metal strips in different layers. All the capacitative components have been computed to measure the total value of capacitance. Comparative study has been undertaken to have a model with least area occupancy as well as less value of total capacitance. We have proposed a complex interconnect geometry to overcome the major problems of area occupancy and the total capacitance.
Keywords :
integrated circuit interconnections; analytical model; capacitative components; complex interconnect geometry; complex interconnect structure modelling; conformal mapping; metal strips; Analytical models; Area measurement; Capacitance; Dielectrics; Geometry; Integrated circuit interconnections; Integrated circuit modeling; Solid modeling; Strips; Wires; Fringe capacitance; conformal mapping; overlap and lateral capacitance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2009 - 2009 IEEE Region 10 Conference
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-4546-2
Electronic_ISBN :
978-1-4244-4547-9
Type :
conf
DOI :
10.1109/TENCON.2009.5396240
Filename :
5396240
Link To Document :
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