DocumentCode
3260176
Title
Modelling of complex interconnect structures
Author
Rustagi, Aayush ; Jain, Kanika
Author_Institution
ECE, JIITU, Noida, India
fYear
2009
fDate
23-26 Jan. 2009
Firstpage
1
Lastpage
6
Abstract
Analytical model has been proposed of complex interconnect structure with ten metal strips in different layers. All the capacitative components have been computed to measure the total value of capacitance. Comparative study has been undertaken to have a model with least area occupancy as well as less value of total capacitance. We have proposed a complex interconnect geometry to overcome the major problems of area occupancy and the total capacitance.
Keywords
integrated circuit interconnections; analytical model; capacitative components; complex interconnect geometry; complex interconnect structure modelling; conformal mapping; metal strips; Analytical models; Area measurement; Capacitance; Dielectrics; Geometry; Integrated circuit interconnections; Integrated circuit modeling; Solid modeling; Strips; Wires; Fringe capacitance; conformal mapping; overlap and lateral capacitance;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2009 - 2009 IEEE Region 10 Conference
Conference_Location
Singapore
Print_ISBN
978-1-4244-4546-2
Electronic_ISBN
978-1-4244-4547-9
Type
conf
DOI
10.1109/TENCON.2009.5396240
Filename
5396240
Link To Document