• DocumentCode
    3260305
  • Title

    Energy-aware computation duplication for improving reliability in embedded chip multiprocessors

  • Author

    Chen, G. ; Kandemir, M. ; Li, F.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pennsylvania State Univ.
  • fYear
    2006
  • fDate
    24-27 Jan. 2006
  • Abstract
    Compilers designed for current embedded systems must be capable of addressing multiple constraints such as low power, high performance, small memory footprint and form factor, and high reliability at the same time. In particular, optimizing for one constraint should be performed carefully, considering its impact on other constraints. Recent trends indicate that transient errors are becoming increasingly important in embedded systems. Focusing on an embedded chip multiprocessor and array-intensive applications, this paper demonstrates how reliability against transient errors can be improved without impacting execution time by utilizing idle processors for duplicating some of the computations of the active processors. It also shows how a balance between power savings and reliability improvement can be struck using a metric called the energy-delay-fallibility product. Our experimental results indicate that the "percentage of duplicated computations" is a useful high-level metric for studying the tradeoffs among performance, power, and reliability
  • Keywords
    embedded systems; fault tolerant computing; low-power electronics; microprocessor chips; multiprocessing systems; program compilers; compilers; embedded chip multiprocessor; embedded systems; energy-aware computation duplication; energy-delay-fallibility product; power savings; reliability; transient errors; Computer science; Constraint optimization; Design engineering; Embedded computing; Embedded system; Energy consumption; Power engineering and energy; Power engineering computing; Power system reliability; Reliability engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation, 2006. Asia and South Pacific Conference on
  • Conference_Location
    Yokohama
  • Print_ISBN
    0-7803-9451-8
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2006.1594671
  • Filename
    1594671