• DocumentCode
    3260313
  • Title

    Insulation technology for power semiconductor modules

  • Author

    Muto, Hirotaka ; Shiota, Hiroki ; Hasegawa, Taketoshi

  • Author_Institution
    Adv. Technol. R&D Center, Mitsubishi Electr. Co., Amagasaki
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    671
  • Lastpage
    671
  • Abstract
    As key devices for power conversion, we can expect power semiconductor modules to become increasingly sophisticated in functions and performance in the years to come. This will require the development of advanced insulation materials and design technologies.
  • Keywords
    insulation; power conversion; power semiconductor devices; insulation materials; insulation technology; power conversion; power semiconductor modules; Ceramics; Dielectrics and electrical insulation; Electrodes; Insulation testing; Multichip modules; Partial discharges; Semiconductor device testing; Semiconductor materials; Substrates; Voltage; Insulation; Partial discharge; Power module;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664606
  • Filename
    4664606
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3260313