DocumentCode :
3262244
Title :
Ge-redistributed poly-Si/SiGe stack gate (GRPSG) for high-performance CMOSFETs
Author :
Rhee, H.S. ; Bae, G.J. ; Choe, T.H. ; Kim, S.S. ; Song, S. ; Lee, N.I. ; Fujihara, K. ; Kang, H.K. ; Moon, J.T.
Author_Institution :
Semicond. R&D Div., Samsung Electron. Co. Ltd., Yongin, South Korea
fYear :
2001
fDate :
12-14 June 2001
Firstpage :
61
Lastpage :
62
Abstract :
A Ge-redistributed poly-Si/SiGe stack gate (GRPSG) has been proposed to improve the current performance of PMOS without the degradation of NMOS for sub-0.1 /spl mu/m CMOSFETs with ultrathin gate oxide. Ge diffusion into the poly-Si layer was promoted more by ion implantation of N-type dopants such as P and As rather than P-type dopants. NMOS and PMOS had different Ge concentrations at the interface between gate electrode and gate oxide by an additional anneal to redistribute the Ge profile. The current performance of NMOS with GRPSG with low Ge content (<5%) was not degraded, while that of PMOS with GRPSG with high Ge content (>20%) was improved due to suppression of the poly-depletion effect and boron penetration. In addition, the gate reoxidation was modified to reduce G/sub m/ degradation by reduced gate bird´s beak. High-performance 70 nm-CMOSFETs were successfully fabricated using the simple GRPSG process.
Keywords :
CMOS integrated circuits; Ge-Si alloys; MOSFET; annealing; dielectric thin films; doping profiles; elemental semiconductors; interface states; ion implantation; semiconductor materials; silicon; 0.1 micron; 70 nm; CMOSFETs; GRPSG; GRPSG process; Ge concentration; Ge content; Ge diffusion; Ge profile; Ge-redistributed poly-Si/SiGe stack gate; N-type dopants; NMOSFETs; P-type dopants; PMOSFETs; Si-SiGe; annealing; boron penetration suppression; current performance; gate bird´s beak reduction; gate electrode/gate oxide interface; gate reoxidation; ion implantation; poly-Si layer; poly-depletion effect suppression; transconductance degradation; ultrathin gate oxide; Annealing; Boron; CMOS technology; CMOSFETs; Degradation; Germanium silicon alloys; Ion implantation; MOS devices; Moon; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2001. Digest of Technical Papers. 2001 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
4-89114-012-7
Type :
conf
DOI :
10.1109/VLSIT.2001.934947
Filename :
934947
Link To Document :
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