DocumentCode :
3264754
Title :
Screen printing: a technology for partitioning integrated microsensor processing
Author :
Goldberg, H.D. ; Liu, D.P. ; Hower, R.W. ; Poplawski, M.E. ; Brown, R.B.
Author_Institution :
Michigan Univ., Ann Arbor, MI, USA
fYear :
1992
fDate :
22-25 June 1992
Firstpage :
140
Lastpage :
143
Abstract :
Potentiometric chemical sensors are presented as a case study in the use of screen printing for process partitioning. After CMOS processing, the authors print silver epoxy over the openings in the overglass layer to the aluminum input pads; the silver forms a stable chemical interface to the membranes, and the epoxy forms a strong physical bond to them. The screen-printed silver epoxy allows the use of conventional aluminum metallization in the microelectronic circuits. The polymeric membranes are applied and patterned with screen printing. Membranes of different compositions can be deposited on the various sites of a multisensor chip by simply repositioning the mask and repeating the screen print/cure cycle. There is no cross-contamination of membranes.<>
Keywords :
CMOS integrated circuits; chemical sensors; electric sensing devices; hybrid integrated circuits; integrated circuit technology; membranes; metallisation; polymer films; semiconductor technology; Ag epoxy; Al; CMOS; IC technology; chemical interface; hybrid IC; integrated microsensor processing; masks; metallisation; multisensor chip; overglass layer; partitioning; polymeric membranes; screen-printed silver epoxy; semiconductor technology; Aluminum; Biomembranes; Bonding; CMOS process; CMOS technology; Chemical processes; Chemical sensors; Chemical technology; Printing; Silver;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensor and Actuator Workshop, 1992. 5th Technical Digest., IEEE
Conference_Location :
Hilton Head Island, SC, USA
Print_ISBN :
0-7803-0456-X
Type :
conf
DOI :
10.1109/SOLSEN.1992.228306
Filename :
228306
Link To Document :
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