DocumentCode
3265477
Title
New copper multi layer interconnection technologies for power electronics
Author
Curley, Michael ; Rapoport, Nahum ; Suconick, David
Author_Institution
REMTEC, Canton, MA, USA
fYear
1992
fDate
23-27 Feb 1992
Firstpage
625
Lastpage
632
Abstract
Novel copper multi layer board technologies on ceramic and insulated metal substrates (IMSs), with high current carrying and multilayer capabilities, have been developed. The copper-on-ceramic version is compatible with conventional thick-film technology. Experimental data, comprehensive testing, and thermal evaluation results are presented, along with some typical power electronics applications
Keywords
packaging; power electronics; printed circuit manufacture; printed circuit testing; ceramic substrates; copper multi layer interconnection technologies; insulated metal substrates; power electronics; thermal evaluation results; thick-film technology; Assembly; Ceramics; Conducting materials; Copper; Integrated circuit interconnections; Nonhomogeneous media; Power electronics; Substrates; Thermal conductivity; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1992. APEC '92. Conference Proceedings 1992., Seventh Annual
Conference_Location
Boston, MA
Print_ISBN
0-7803-0485-3
Type
conf
DOI
10.1109/APEC.1992.228353
Filename
228353
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