Nanofabrication from MEMS technology

Author

Wang, Yeulin ; Li, Xinxin ; Li, Tie ; Yang, Heng ; Jiao, Jiwei

Author_Institution

Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai, China

Volume

3

fYear

2004

fDate

18-21 Oct. 2004

Firstpage

1839

Abstract

In this paper is reviewed a novel nanofabrication method that has been developed from the traditional MEMS technology with anisotropic etching, deep reaction ion etching and sacrificial layer processes. With such a new technology, nano needles, nano wires, nano beams, even nano devices, can be fabricated in a batch process. Beams with thickness of 12 nm, a nano tip with a heater on the beam, and a nano wire the width and thickness of which is only 50 nm, are demonstrated. The scale effect of the Young´s modulus of silicon has been observed and nano-electronic-mechanical data storage has been achieved.

Keywords

Young´s modulus; batch processing (industrial); etching; micromechanical devices; nanotechnology; nanowires; 12 nm; 50 nm; MEMS technology; Young´s modulus scale effect; anisotropic etching; batch process; deep reaction ion etching; nano beams; nano devices; nano needles; nano tip beam heater; nano wires; nano-electronic-mechanical data storage; nanofabrication; sacrificial layer process; Anisotropic magnetoresistance; Dry etching; Micromechanical devices; Nanofabrication; Piezoresistance; Probes; Scanning electron microscopy; Silicon; Wet etching; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on

Print_ISBN

0-7803-8511-X

Type

conf

DOI

10.1109/ICSICT.2004.1435193

Filename

1435193