Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder

Author

Weiss, Stefan ; Kaulfersch, Eberhard ; Töpfer, Manfred ; Zakel, Elke ; Michel, Bernd ; Reichl, Herbert

Author_Institution

Center of Microperipheric Technol., Tech. Univ. Berlin, Germany

Volume

2

fYear

1997

fDate

10-13 Nov 1997

Firstpage

281

Abstract

Laser bars typically have a size of 10×0.6×0.1 mm³ and an optical output power of more than 10 watt. Commercially these bars are bonded using soft solders like In or eutectic PbSn-solder. Soft solders lead to migration, whiskers at the bond and an increasing of the thermal resistance. Commercial manufactures using such packaging technique only guarantee a lifetime in the range of 5,000 hours. Instead we use a highly reliable and fluxless contact can be achieved by using the eutectic Au(80)Sn(20)-solder

Keywords

gold alloys; life testing; microassembling; optical fabrication; optical testing; semiconductor device packaging; semiconductor device testing; semiconductor lasers; thermal conductivity; tin alloys; 0.1 mm; 0.6 mm; 10 W; 10 mm; 5000 h; Au(80)Sn(20)-solder; Au₈₀Sn₂₀; bond; commercial manufactures; eutectic Au(80)Sn(20)-solder; fluxless contact; fluxless die bonding; high power laser bars; highly reliable; life testing; migration; optical output power; semiconductor laser testing; thermal resistance; whiskers; Bars; Bonding; Lead; Manufacturing; Microassembly; Optical design; Packaging; Power generation; Power lasers; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE

Conference_Location

San Francisco, CA

ISSN

1092-8081

Print_ISBN

0-7803-3895-2

Type

conf

DOI

10.1109/LEOS.1997.645418

Filename

645418