Title :
SPICE simulation of power supply current from LSI on PCB with a behavioral model
Author :
Irino, Hitoshi ; Wabuka, Hiroshi ; Tamaki, Naoya ; Masuda, Norio ; Tohya, Hirokazu
Author_Institution :
Device Anal. Technol. Labs., NEC Corp., Kawasaki, Japan
Abstract :
This paper proposes a new behavioral model of an LSI to simulate current in the power supply line of a PCB. The model´s impedance changes with time, thus ensuring simulation accuracy. The new model makes it possible to easily simulate the current in a PCB power supply line. Good agreement is obtained between simulated values and measured in experiments
Keywords :
SPICE; circuit simulation; large scale integration; power supply circuits; printed circuits; LSI; PCB; SPICE simulation; behavioral model; computer simulation; power supply current; simulation accuracy; Analytical models; Circuit simulation; Current supplies; Electromagnetic interference; Impedance; Large scale integration; Power supplies; SPICE; Very large scale integration; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 1999 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-9980748-4-9
DOI :
10.1109/ELMAGC.1999.801304
