• DocumentCode
    3273167
  • Title

    Integrated front-end/back-end simulation of electromagnetic fields, Lorentz force effects and fast current surges in microelectronic protection devices

  • Author

    Schoenmaker, Wim ; Galy, Philippe

  • Author_Institution
    Magwel NV, Leuven, Belgium
  • fYear
    2015
  • fDate
    1-3 June 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We presented a full simulation picture of fast-transient current surges including self-induced electromagnetic effects as well as a method to compute the impact of the Lorentz force. We applied the proposed method to an ESD protection structure consisting of an SRC and diode. We observed that the magnetic effects, with and without inclusion of the Lorentz force deflection of the currents have a negligible effect on the circuit-element characteristics. However, the local current densities inside the device are effected. This will impact the device reliability for electromigration robustness. Finally, we emphasize that the simulation techniques of this paper have a much wider applicability than presented here. For example, the simulation tools may be used to analyze magnetic field sensors, integrated passives and large-area substrate effects.
  • Keywords
    electromagnetic fields; electromigration; integrated circuit reliability; ESD protection; Lorentz force deflection; Lorentz force effects; SRC; back-end simulation; device reliability; diode; electromagnetic fields; electromigration robustness; fast current surges; fast-transient current surges; front-end simulation; integrated passives; large-area substrate effects; magnetic field sensors; microelectronic protection devices; self-induced electromagnetic effects; Computational modeling; Current density; Electrostatic discharges; Lorentz covariance; Mathematical model; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design & Technology (ICICDT), 2015 International Conference on
  • Conference_Location
    Leuven
  • Type

    conf

  • DOI
    10.1109/ICICDT.2015.7165910
  • Filename
    7165910