3D monolithic integration: Stacking technology and applications

Wafer level stacking of single crystal films enables 3D monolithic integration of electronic devices. The monolithic stacking technology based on Smart Cut^TM enables front end integration of large variety of devices with nanometer alignment capability; therefore it provides more degree of freedom for the designers and integration for high density and better performance. Several applications can fully take the advantage of using the monolithic 3D stacking technology.