Title :
Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder
Author :
Pang, John H L ; Xiong, B.S. ; Low, T.H.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
The creep and fatigue properties of 95.5Sn-3.8Ag-0.7Cu lead free solders were investigated. Steady-state creep behavior for 95.5Sn-3.8Ag-0.7Cu bulk solder specimens were compared to reported creep test data for solder joints. Tests were carried out at four different temperatures (-40°C, 25°C, 75°C and 125°C) and a range of stress levels. The constitutive equation for the steady-state creep law is reported. Low cycle fatigue behavior for 95.5Sn-3.8Ag-0.7Cu bulk solder specimens were investigated over a range of test temperatures (-40°C, 25°C, 75°C and 125°C) and frequencies (1 Hz, 0.01 Hz, and 0.001 Hz). Frequency modified strain-based and energy-based low cycle fatigue models are proposed for solder fatigue life prediction analysis.
Keywords :
copper alloys; creep; fatigue; silver alloys; solders; thermal stresses; tin alloys; -40 degC; 0.001 Hz; 0.01 Hz; 1 Hz; 125 degC; 25 degC; 75 degC; SnAgCu; bulk solder; energy-based fatigue models; frequency modified strain-based fatigue models; lead free solder; low cycle fatigue behavior; solder creep; solder fatigue; solder fatigue life prediction analysis; solder joints; steady-state creep law constitutive equation; stress testing; test frequencies; test temperatures; Creep; Environmentally friendly manufacturing techniques; Fatigue; Frequency; Lead; Soldering; Steady-state; Stress; Temperature distribution; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320285
