Title :
Design and optimization of 3D RF modules, microsystems and packages using electromagnetic, statistical and genetic tools [mm-wave interdigitated passband filter application]
Author :
Bushyager, N. ; Staiculescu, D. ; Martin, L. ; Lee, J.-H. ; Vasiloglou, N. ; Tentzeris, M.M.
Author_Institution :
Sch. of ECE, Georgia Tech, Atlanta, GA, USA
Abstract :
The successful use of the design of experiments (DOE) and response surface modeling (RSM) approaches in an optimization study for a multilayer interdigitated passband filter is presented. The medium of interest is liquid crystal polymer (LCP) and the frequency band is in the 60 GHz range. The two figures of merit chosen are the resonating frequency and the quality factor Q with the optimization goals of fo=60 GHz and maximum Q. The electromagnetic performance of the filter is determined with a method of moments commercial simulator. The results of these simulations are incorporated into DOE and RSM techniques, statistical models are developed for the two output variables, and then applied to optimize the filter. The effectiveness of the method is compared to that of the genetic algorithm (GA) optimization.
Keywords :
Q-factor; band-pass filters; circuit optimisation; circuit resonance; computational electromagnetics; design of experiments; electronics packaging; genetic algorithms; liquid crystal polymers; method of moments; millimetre wave filters; modules; response surface methodology; 3D RF modules; 60 GHz; DOE; LCP; RSM; design of experiments; electromagnetic modeling tools; filter optimization; genetic algorithm optimization; liquid crystal polymer; method of moments simulator; microsystems; multilayer interdigitated passband filter; packages; quality factor; quarter wavelength parallel coupled lines; resonating frequency; response surface modeling; statistical models; statistical tools; Band pass filters; Design optimization; Genetics; Nonhomogeneous media; Optimization methods; Packaging; Passband; Radio frequency; Response surface methodology; US Department of Energy;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320297
