• DocumentCode
    3274196
  • Title

    SystemC Transaction Level Modeling and Verification of IEEE 802.15.3 MAC

  • Author

    Wei, Yu ; Guanghui, He ; Ningyi, Xu ; Zucheng, Zhou

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing
  • Volume
    4
  • fYear
    2006
  • fDate
    25-28 June 2006
  • Firstpage
    2554
  • Lastpage
    2558
  • Abstract
    As implementation technology has evolved into increasingly complex integrated circuits and time-to-market pressure increases day by day, system level design issues become more critical in the context of system on Chip, which gives rise to the need for abstract executable specifications (models) covering both hardware and embedded software. The new capabilities of SystemC 2.0, such as those added for transaction-based communication and test-bench specification and monitoring, facilitate this SoC modeling. In this paper, we present a transaction level modeling and verification method of IEEE 802.15.3 MAC chip based on SystemC 2.0, which include an accuracy video model and a transaction level system model of IEEE 802.15.3 MAC protocol. With the proposed scheme, we can get a reusable test bench which can be used at both transaction level and register transfer level. In this case, the verification efficiency and accuracy will be greatly improved. Specially, the transaction level model can significantly reduce product development risk while avoiding expensive over- engineering by ensuring the architecture meets all performance, power and cost requirements prior to implementation, allowing design resources to focus on value- added functions.
  • Keywords
    access protocols; formal specification; formal verification; hardware description languages; integrated circuit design; system-on-chip; wireless LAN; IEEE 802.15.3 MAC protocol; SoC modeling; SystemC 2.0; SystemC transaction level modeling; abstract executable specifications; accuracy video model; embedded software; product development risk; register transfer level; reusable test bench; system level design; system on chip; test-bench specification; time-to-market pressure; transaction level system model; transaction-based communication; value-added functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems Proceedings, 2006 International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    0-7803-9584-0
  • Electronic_ISBN
    0-7803-9585-9
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2006.285195
  • Filename
    4064442