DocumentCode :
3275160
Title :
Heat spreader impact on electrical performances of a 4-layer PBGA package
Author :
Pan, S.J. ; Chong, Desmond Y R ; Sun, Anthony Y S
Author_Institution :
United Test & Assembly Center Ltd., Singapore, Singapore
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1772
Abstract :
Electrical simulations are performed for a 4-layer 388-ball PBGA package to investigate the heat spreader (HS) impact on electrical performances at high frequencies. The results show that a heat spreader, no matter floating or grounded, can help to minimize both the self and mutual inductances in a relatively low frequency range. However, a grounded HS can help to maximize the signal transmission efficiency due to low losses. In addition, grounding the HS mitigates the electromagnetic interference (EMI) issues that may occur in a floating HS case at high frequencies and at the same time helps to push the self-resonant frequency of the package to a higher value, which effectively widens the bandwidth of the package.
Keywords :
S-parameters; ball grid arrays; earthing; electromagnetic interference; equivalent circuits; heat sinks; inductance; integrated circuit packaging; plastic packaging; thermal management (packaging); 4-layer PBGA package; IC packaging; S-parameters; effective inductance; electrical performances; electrical simulations; electromagnetic interference; equivalent circuit; grounding; heat spreader impact; high frequencies; low losses; mutual inductances; self inductances; self-resonant frequency; signal transmission efficiency; solder ball arrays; Circuit simulation; Computational modeling; Electromagnetic interference; Frequency; Grounding; Packaging; Performance evaluation; Resistance heating; Sun; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320358
Filename :
1320358
Link To Document :
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