Title :
Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period
Author :
Bhowmik, H. ; Tou, K.W. ; Tso, C.P.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm2 to 0.6 W/cm2. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.
Keywords :
forced convection; heat transfer; natural convection; thermal management (packaging); geometric parameters; heat flux; in-line four simulated flush mounted electronic chips; natural convection heat transfer; power-on transient period; simulated electronic chips; water cooling study; Electronics cooling; Heat engines; Heat transfer; Multichip modules; Production engineering; Temperature sensors; Testing; Thermal conductivity; Thermal expansion; Water heating;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
Print_ISBN :
0-7803-8363-X
DOI :
10.1109/STHERM.2004.1291314