DocumentCode :
3277445
Title :
Characterization of airflow impedance in two types of telecommunications chassis
Author :
Rhee, Jinny ; Wong, Gilbert
Author_Institution :
San Jose State Univ., CA, USA
fYear :
2004
fDate :
9-11 Mar 2004
Firstpage :
161
Lastpage :
167
Abstract :
The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).
Keywords :
atmospheric turbulence; heat transfer; telecommunication equipment; thermal management (packaging); Reynolds number; airflow impedance curve; increased altitude; nondimensional coordinates; telecommunications chassis; Coordinate measuring machines; Electrical resistance measurement; Electronic components; Electronics cooling; Fans; Impedance measurement; Ocean temperature; Sea level; Sea measurements; Telecommunication standards;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-8363-X
Type :
conf
DOI :
10.1109/STHERM.2004.1291319
Filename :
1320470
Link To Document :
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