DocumentCode :
3278744
Title :
Low DC current 2.4-2.5 GHz and 4.9-6.0 GHz linear power amplifier modules for IEEE 802.11a/b/g applications
Author :
Dow, G. Samuel ; Ho, Richard ; Chin, Matthew ; Yu, Mark
Author_Institution :
AIM Wireless Inc., Westlake Village, CA, USA
fYear :
2004
fDate :
6-8 June 2004
Firstpage :
75
Lastpage :
78
Abstract :
Internally matched 802.11b/g and 802.11a power amplifier modules are discussed. The RFIC designs were based on InGaP/GaAs technology. The 802.11b/g PA module is a two-stage amplifier design and has achieved a power gain of 29.4 dB, an EVM of 4.2% at 20 dBm, and consumes only 100 mA. The 802.11a PA module is a three-stage amplifier design. It covers full worldwide WLAN (wireless local area network) frequencies of 4.9-5.825 GHz. At 5.15 GHz, the amplifier has achieved a power gain of 24 dB, an EVM of 3.9% at 19 dBm. and consumes <170 mA. A two-stage 802.11a PA module covering the U-NII band of 5.15-5.35 GHz is also demonstrated. The amplifier has achieved a power gain of 16 dB, an EVM of 4.2% at 23 dBm and consumes 201 mA. The idle current is only 50 mA.
Keywords :
MMIC power amplifiers; UHF integrated circuits; UHF power amplifiers; gallium arsenide; gallium compounds; indium compounds; integrated circuit design; modules; wireless LAN; 100 mA; 16 dB; 2.4 to 2.5 GHz; 201 mA; 24 dB; 29.4 dB; 4.9 to 5.825 GHz; 50 mA; IEEE 802.11a; IEEE 802.11b; IEEE 802.11g; InGaP-GaAs; RFIC design; WLAN; linear power amplifier modules; power gain; three-stage amplifier; two-stage amplifier; wireless local area network; Gain; Gallium arsenide; Heterojunction bipolar transistors; MMICs; Packaging; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits; Wireless LAN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
ISSN :
1529-2517
Print_ISBN :
0-7803-8333-8
Type :
conf
DOI :
10.1109/RFIC.2004.1320531
Filename :
1320531
Link To Document :
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