DocumentCode :
3279691
Title :
Thermal optimization of a miniaturized camera with Pentium PC module
Author :
Vogel, Fabian ; Köthe, Remo ; Stössel, Zeno ; Kiser, Andy
Author_Institution :
Univ. of Appl. Sci. of Central Switzerland, Horw, Switzerland
fYear :
2002
fDate :
10-12 Dec. 2002
Firstpage :
446
Lastpage :
449
Abstract :
In miniaturization with high-speed components, where power dissipation is not negligible, thermal management and thermal design become more and more important. To design and build systems first time right, thermal design with simulation becomes of paramount importance. A miniaturized camera module with built in Pentium III PC, including hard disk and standard PC interfaces, is a system of non negligible power dissipation. Such a system shall be further miniaturized. More functions shall be built in and a faster processor with higher power dissipation shall be used. With thermal simulation, different strategies for heat dissipation are analyzed and validated with measurements. An important condition is that the proposals are producible. We describe the system, the different strategies of power dissipation, the results of the simulation and results of the validation measurements. We discuss the results, their accuracy and their limits.
Keywords :
cameras; cooling; finite element analysis; microcomputers; modules; optimisation; thermal analysis; thermal management (packaging); PC interfaces; Pentium PC module; finite element simulation; hard disk; heat dissipation; miniaturization; miniaturized camera; power dissipation; thermal design; thermal management; thermal optimization; thermal simulation; Computational modeling; Conductivity; Connectors; Digital cameras; Energy management; Hard disks; Power dissipation; Power system management; Solid modeling; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185713
Filename :
1185713
Link To Document :
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