Title :
Young´s modulus size effect of SCS nanobeam by tensile testing in electron microscopy
Author :
Jin, Q.H. ; Li, T. ; Wang, Y.L. ; Li, X.X. ; Yang, H. ; Xu, F.F.
Author_Institution :
State Key Labs. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
Abstract :
In-situ tensile testing in EM (electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. In this work, MEMS tensile-testing chips with differently thick <110>-oriented SCS nanobeams were designed, fabricated and utilized in SEM and/or TEM to manipulate SCS nanobeam and measure its strain and stress in nano scale. We obtained Young´s modulus of SCS nanobeams with thicknesses from 30 nm to 100 nm, and found that E decreased monotonously with the beams decreasing thickness. A simple modal was constructed to qualitatively illustrate this size dependence by taking surface effect into account and it shows that surface layers have different effects on E in tensile testing from that in resonant testing.
Keywords :
Young´s modulus; mechanical properties; micromechanical devices; nanostructured materials; scanning electron microscopy; size effect; tensile testing; transmission electron microscopy; MEMS tensile-testing chips; SCS nanobeam; SEM; TEM; Young´s modulus; electron microscopy; mechanical properties; nanostructured materials; single crystalline silicon; size effect; Atomic measurements; Electron microscopy; Mechanical factors; Micromechanical devices; Scanning electron microscopy; Strain measurement; Stress measurement; Tensile stress; Testing; Transmission electron microscopy;
Conference_Titel :
Sensors, 2009 IEEE
Conference_Location :
Christchurch
Print_ISBN :
978-1-4244-4548-6
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2009.5398190