DocumentCode
328146
Title
Laser flip-chip mounting for passive alignment and high-frequency modulation
Author
Lindgren, Stefan ; Ahlfeldt, Henrik ; Backlin, Lennart ; Forssen, Lili ; Vieider, Christian ; Elderstig, Hakan ; Svensson, Magnus ; Granlund, Lennart ; Kerzar, Boris ; Broberg, Bjom ; Kjebon, Olle ; Schatz, Richard ; Forzelius, Elisabeth ; Nilsson, Stefan
Author_Institution
Ind. Microelectron. Center, Kista, Sweden
Volume
1
fYear
1996
fDate
19-19 Sept. 1996
Firstpage
103
Abstract
We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.
Keywords
electro-optical modulation; flip-chip devices; integrated optoelectronics; optical fibre couplers; optical transmitters; optical workshop techniques; silicon; 24 GHz; broadband access networks; high-frequency modulation; laser flip-chip mounting; optical transmitters; passive alignment; semiconductor lasers; silicon motherboard; single-mode fibre/laser coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communication, 1996. ECOC '96. 22nd European Conference on
Conference_Location
Oslo, Norway
Print_ISBN
82-423-0418-1
Type
conf
Filename
713750
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