DocumentCode :
3283238
Title :
A packaged 86–98 GHz CMOS transmitter for FMCW radar applications with 30 dBm of EIRP
Author :
Jameson, Samuel ; Socher, Eran
Author_Institution :
Sch. of Electr. Eng., Tel Aviv Univ., Tel Aviv, Israel
fYear :
2015
fDate :
17-22 May 2015
Firstpage :
1
Lastpage :
4
Abstract :
In this paper a packaged X-band to W-band x9 active multiplying chain in CMOS 65 nm technology is presented. The integrated circuit was packaged and connectorized to allow FMCW Radar system operation. Wire bonds and a microstrip-to-waveguide transition were used at the output. On-chip probing showed a maximum output power of +9.7 dBm, a 3 dB bandwidth of 13% (86-98 GHz) while consuming 280 mW of DC power. An EIRP of +29.8 dBm was measured at 92 GHz by connecting a WR-10 pyramidal horn antenna to the WR-10 package output. The generic package can be employed to any circuit with an output signal from 67 to 110 GHz introducing an average 3.5 dB insertion loss in the package RF path.
Keywords :
CMOS integrated circuits; CW radar; FM radar; field effect MMIC; horn antennas; integrated circuit packaging; lead bonding; microstrip transitions; radio transmitters; waveguide transitions; CMOS technology; FMCW radar; W-band multiplying chain; WR-10 pyramidal horn antenna; X-band multiplying chain; frequency 67 GHz to 110 GHz; integrated circuit packaging; microstrip-to-waveguide transition; on-chip probing; packaged CMOS transmitter; power 280 mW; size 65 nm; wire bonds; x9 active multiplying chain; CMOS integrated circuits; Coplanar waveguides; Electrostatic discharges; Indexes; Logic gates; Phase locked loops; Radar; CMOS; Frequency Multiplier; Package; Power Amplifier; RF; Transmitter; W-band; Wire-bond; X-band; mm wave;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium (IMS), 2015 IEEE MTT-S International
Conference_Location :
Phoenix, AZ
Type :
conf
DOI :
10.1109/MWSYM.2015.7166731
Filename :
7166731
Link To Document :
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