DocumentCode
3286187
Title
Modeling ground plane cuts using transmission line theory
Author
Tuncer, Enis ; Yuan, F.Y.
Author_Institution
Quad Design Technol., Camarillo, CA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
229
Lastpage
231
Abstract
In terms of signal integrity in complex digital and mixed signal PCBs, the effects of ground cuts and split planes has to be analyzed accurately. In this work ground cuts and split planes are modeled using transmission line approach, and results are presented compared to FDTD calculations and measurements
Keywords
finite difference time-domain analysis; packaging; printed circuit design; transmission line theory; FDTD calculations; digital PCBs; ground plane cuts; mixed signal PCBs; signal integrity; split planes; transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564840
Filename
564840
Link To Document