DocumentCode
3288677
Title
Modeling broadside coupled traces using equivalent per unit length (Eq PUL) RLGC model
Author
Chada, Arun Reddy ; Songping Wu ; Jun Fan ; Drewniak, James L. ; Mutnury, Bhyrav ; de Araujo, Daniel N.
Author_Institution
Missouri S&T EMC Lab., Missouri S&T, Rolla, MO, USA
fYear
2012
fDate
21-24 Oct. 2012
Firstpage
339
Lastpage
342
Abstract
Increases in printed circuit board (PCB) cost is leading to denser routing of high speed signal traces and this, in turn, is increasing the crosstalk among the traces. The crosstalk between the broadside coupled traces in adjacent layers is becoming an important factor to account for as the signal speeds increase. The coupling between parallel broadside coupled traces can be modeled using multi-conductor transmission line theory based on telegrapher equations using equivalent per-unit-length (Eq PUL) resistance, inductance, capacitance, and conductance (RLCG) matrices. The same approach is not applicable for the traces crossing at an arbitrary angle. A fast methodology to develop Eq PUL RLGC models that captures the coupling physics of broadside coupled traces crossing at an angle based on geometrical parameters of the stackup, and the dielectric material properties is proposed based on the idea presented in [1]. In this paper, validation of these equivalent models is done by estimating the crosstalk impact on eye opening at a specified bit error rate (BER) at different signal speeds and results are compared against full wave models.
Keywords
coupled circuits; crosstalk; dielectric materials; error statistics; multiconductor transmission lines; printed circuits; transmission line theory; PCB cost; bit error rate; broadside coupled trace modeling; capacitance matrix; conductance matrix; crosstalk impact estimation; dielectric material property; equivalent per unit length RLGC model; equivalent per-unit-length resistance matrix; geometrical parameter; inductance matrix; multiconductor transmission line theory; parallel broadside coupled trace; printed circuit board cost; signal trace routing; telegrapher equation; Bit error rate; Couplings; Crosstalk; Equations; Integrated circuit modeling; Mathematical model; Scattering parameters; Broadisde Coupled; per-unit-length(PUL) RLGC;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location
Tempe, AZ
Print_ISBN
978-1-4673-2539-4
Electronic_ISBN
978-1-4673-2537-0
Type
conf
DOI
10.1109/EPEPS.2012.6457911
Filename
6457911
Link To Document