Title :
Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxes
Author :
Sjoberg, Jonas ; Geiger, David A. ; Shangguan, Dongkai ; Castello, Todd
Author_Institution :
Flextronics, Linkoping, Sweden
Abstract :
This study is focused on the assembly and reliability of 200-250um-pitch, lead-free (SnAgCu) flip chips on FR4 substrates. The impact of different PCB surface finishes (OSP and ENIG) was investigated from assembly and reliability perspectives. Different underfill materials (including an acid anhydrate-based material and two nonacid anhydrate-based materials) were evaluated for compatibility with the flux and lead-free solder bumps and process.
Keywords :
flip-chip devices; integrated circuit reliability; printed circuits; solders; substrates; surface finishing; ENIG; FR-4 substrates; OSP; PCB surface finishes; SnAgCu; acid anhydrate; assembly; fluxes; lead-free solder bumps; lead-free solder flip chips; nonacid anhydrate; reliability; underfill materials; underfills; Assembly; Costs; Environmentally friendly manufacturing techniques; Flip chip; Lead; Nickel; Packaging; Substrates; Surface finishing; Testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321628
