DocumentCode
329138
Title
Fabrication Of SOI Wafers With Buried Cavities Using Silicon Fusion Bonding And Electrochemical Etchback
Author
Noworolski, J. Mark ; Klaassen, Erno ; Logan, John ; Petersen, Kurt ; Maluf, Nadim
Author_Institution
UC Berkeley
Volume
1
fYear
1995
fDate
25-29 Jun 1995
Firstpage
71
Lastpage
74
Keywords
Actuators; Costs; Crystalline materials; Etching; Fabrication; Manufacturing; Micromechanical devices; Silicon on insulator technology; Thickness control; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN
91-630-3473-5
Type
conf
DOI
10.1109/SENSOR.1995.717090
Filename
717090
Link To Document