Title :
Packaging of ISFETs at the Wafer Level by Photopatternable Encapsulant Resins
Author :
Munoz, J. ; Bratov, Andrey ; Mas, R. ; Abramova, N. ; Dominguez, C. ; Bartoli, J.
Author_Institution :
Centro Nacional de Microelectronica-CSIC
Keywords :
Adhesives; Encapsulation; Lithography; Microsensors; Packaging; Polymers; Resins; Silicon; Testing; Wafer scale integration;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717158
