Title :
Proposal For New Multichip-on-silicon Packaging Scheme
Author :
Guerin, L. ; Achaer, M.A. ; Sachot, R. ; Dutoit, M.
Author_Institution :
Swiss Federal Institute of Technology
Keywords :
Actuators; Assembly; Circuits; Electronic packaging thermal management; Proposals; Rough surfaces; Silicon; Surface roughness; Temperature; Wafer bonding;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717160
