DocumentCode

329178

Title

Proposal For New Multichip-on-silicon Packaging Scheme

Author

Guerin, L. ; Achaer, M.A. ; Sachot, R. ; Dutoit, M.

Author_Institution

Swiss Federal Institute of Technology

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

252

Lastpage

255

Keywords

Actuators; Assembly; Circuits; Electronic packaging thermal management; Proposals; Rough surfaces; Silicon; Surface roughness; Temperature; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717160

Filename

717160