Flexible polysiloxane Interconnection Between Two Substrates For Microsystem Assembly

Author

Arquint, Philippe ; Van der Wal, Peter D. ; Van der Schoot, Bart H. ; De Rooij, Nico F.

Author_Institution

Universit of Neuchatel

Volume

fYear

1995

fDate

25-29 Jun 1995

Firstpage

263

Lastpage

264

Keywords

Adhesives; Assembly systems; Bonding; Curing; Humidity; Lithography; Polymer films; Silicon; Substrates; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

DOI

10.1109/SENSOR.1995.717164

Filename

717164

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