DocumentCode
3293284
Title
Modifications of fillet structures to form tip emitters
Author
Fleming, J.G. ; King, Donald B. ; Talin, A.A. ; Felter, T. ; Malinowski, M.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
1996
fDate
7-12 Jul 1996
Firstpage
375
Lastpage
379
Abstract
In order to reduce the turn-on voltage of vacuum microelectronic devices, it is desirable that the field enhancement of the emitter be maximized. We have previously developed a gated manufacturable emitter process which uses fillets as emitters. Since tips have higher field enhancement then fillets we have tried to adapt our process to incorporate tip emitters. Two different approaches have been developed to try to achieve this goal. The first approach employs a sputter etch to form a tip on the end of a spike. Unfortunately, the tip formed is not sufficiently sharp enough to reduce the turn on voltage. In the second approach, the corners of a mold are sharpened during the deposition of the spacer material. The emitter material is then deposited and following the removal of the spacer, a very sharp tip remains
Keywords
electron field emission; sputter etching; vacuum microelectronics; field enhancement; fillet structures; mold corners; spacer material; sputter etch; tip emitters; turn-on voltage; vacuum microelectronic devices; Amorphous materials; Fabrication; Laboratories; Lithography; Microelectronics; Silicon compounds; Sputter etching; Substrates; Tin; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Microelectronics Conference, 1996. IVMC'96., 9th International
Conference_Location
St. Petersburg
Print_ISBN
0-7803-3594-5
Type
conf
DOI
10.1109/IVMC.1996.601845
Filename
601845
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