DocumentCode :
3293716
Title :
Wonderful new materials or yield killers? New metrics for metal contamination assessment
Author :
Catana, Gabriela ; Bearda, Twan ; Hellin, David ; Vos, Rita
Author_Institution :
IMEC, Leuven
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
175
Lastpage :
178
Abstract :
A new metrics for metal contamination assessment has been developed, based on three key factors: the detrimental impact, the control capability and the cross-contamination risk. This system is currently being used to manage the introduction of new materials such as high-k and metal gate at IMEC´s pilot line. At the same time it forms the basis of the new contamination protocol fully implemented in our 300 mm facility.
Keywords :
contamination; integrated circuit yield; semiconductor technology; IMEC; contamination protocol; cross-contamination risk; integrated circuit yield; metal contamination assessment; new material; pilot line; Contamination; Heat treatment; Monitoring; Nitrogen; Pollution measurement; Protocols; Rapid thermal annealing; Semiconductor materials; Silicon; US Department of Transportation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493053
Filename :
4493053
Link To Document :
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