DocumentCode
3294444
Title
Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
Author
Chien, Chen-Fu ; Hsu, Chia-Yu ; Chou, Hong-Shing ; Lin, Chih-Wei
Author_Institution
Taiwan Semicond. Manuf. Co., Hsinchu
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
317
Lastpage
320
Abstract
Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor manufacturing. However, little research has been done to address productivity from the perspective of wafer exposure performance. This study aims to propose a novel standard, overall wafer effectiveness (OWE), to evaluate the effectiveness of wafer exposure rather than only considering tool productivity. Furthermore, the proposed OWE can be easily extended to incorporate additional attributes such as throughput, yield, and price. In particular, a weighted OWE that integrates mask field utilization and OWE is illustrated with numerical example to show the practical viability of OWE as a semiconductor industry standard to drive collaborative efforts among IC designers, equipment vendors, and manufacturers for enhancing total wafer effectiveness.
Keywords
productivity; semiconductor device manufacture; standards; collaborative efforts; industry standard; overall wafer effectiveness; semiconductor manufacturing; tool productivity; wafer productivity; Availability; Collaboration; Electronics industry; Extraterrestrial measurements; Manufacturing industries; Particle measurements; Performance analysis; Performance loss; Productivity; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493094
Filename
4493094
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