• DocumentCode
    3294444
  • Title

    Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity

  • Author

    Chien, Chen-Fu ; Hsu, Chia-Yu ; Chou, Hong-Shing ; Lin, Chih-Wei

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsinchu
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    317
  • Lastpage
    320
  • Abstract
    Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor manufacturing. However, little research has been done to address productivity from the perspective of wafer exposure performance. This study aims to propose a novel standard, overall wafer effectiveness (OWE), to evaluate the effectiveness of wafer exposure rather than only considering tool productivity. Furthermore, the proposed OWE can be easily extended to incorporate additional attributes such as throughput, yield, and price. In particular, a weighted OWE that integrates mask field utilization and OWE is illustrated with numerical example to show the practical viability of OWE as a semiconductor industry standard to drive collaborative efforts among IC designers, equipment vendors, and manufacturers for enhancing total wafer effectiveness.
  • Keywords
    productivity; semiconductor device manufacture; standards; collaborative efforts; industry standard; overall wafer effectiveness; semiconductor manufacturing; tool productivity; wafer productivity; Availability; Collaboration; Electronics industry; Extraterrestrial measurements; Manufacturing industries; Particle measurements; Performance analysis; Performance loss; Productivity; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493094
  • Filename
    4493094