• DocumentCode
    3294516
  • Title

    Investigation of the influence of substrate temperature on the thermal resistance and square stability of amorphous titanium-vanadium oxide films

  • Author

    Ju, Y.F. ; Wu, Z.M. ; Luo, Z.F. ; Dong, X. ; Jiang, X.J. ; Li, L. ; Jiang, Y.D.

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    348
  • Lastpage
    351
  • Abstract
    Stability of materials is of great technical importance for materials to be applied technologically. In this paper, a novel material-amorphous composite films of titanium and vanadium oxides films, which may have a very promising industrial application, were obtained by reactive dc magnetron co-sputtering deposition. The dependence of thermal resistance and square resistance stability of the samples on the different substrate temperature during the co-sputtering deposition was investigated. Furthermore, analysis of square resistance and its stability of the samples demonstrated that the substrate temperature during the deposition played a very important role on the electrical properties and square resistance stability of the films. The width of the thermal resistance hysteresis loop was also observed to be varied with the substrate temperature.
  • Keywords
    amorphous magnetic materials; ferroelectric thin films; sputter deposition; titanium compounds; vanadium compounds; TiO; VO; amorphous composite films; reactive dc magnetron co-sputtering deposition; square resistance stability; substrate temperature; thermal resistance hysteresis loop; Amorphous magnetic materials; Amorphous materials; Electric resistance; Magnetic analysis; Magnetic materials; Stability analysis; Temperature dependence; Thermal resistance; Thermal stability; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232636
  • Filename
    5232636